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Packaging of CMOS MEMS

Published:2000-08 Issue:8-10 Volume:40 Page:1255-1262
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Baltes Henry,Brand Oliver,Waelti Marc

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. Brand O, Hornung M, Mayer F, Waelti M. Microsensor packaging, FSRM Training Course in Microsystems, Switzerland (http://www.fsrtn.ch).

2. Challenges in the packaging of MEMS;Malshe;J. Microcircuits and Electronic Packaging,1999

3. Packaging for sensors;Frank,1994

4. Intelligent CMOS sensors;Hierold,2000

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4. Design of 2-DOF Precision Positioning Table for IC Packaging;Advanced Materials Research;2012-02

5. Porous Ceramic Packaging for a MEMS Humidity Sensor Requiring Environmental Access;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-03

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