Affiliation:
1. Academy of Military Transportation
2. The Academy of Military Transportation
3. Tianjin University
Abstract
A VCA direct-drive 2-DOF precision positioning table is put forward, which can be applied to IC packaging for wafer wire bonding equipment. With the help of a novel elastic decoupling mechanism, the VCA is mounted on the baseboard, diminishing its moving inertia, improving its dynamic performance. The table structural is detailed and its dynamic design approach is proposed. The prototype experiment shows that the new 2-DOF positioning table is of higher speed and higher accuracy than the traditional ones.
Publisher
Trans Tech Publications, Ltd.
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