Evaluation of the thermal resistance of AlCu electromigration test structures-Reference-Cited by-同舟云学术

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Evaluation of the thermal resistance of AlCu electromigration test structures

Published:2000-08 Issue:8-10 Volume:40 Page:1317-1322
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Braghieri A.,De Munari I.,Impronta M.,Scorzoni A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. ElectromigrationTesting of Integrated Circuit Interconnections;Fantini;Microelectronic Engineering,1998

2. The Measurement, Use and Interpretation of the Temperature Coefficient of Resistance of Metallizations;Shafft;Solid-State Electronics,1992

3. A Proposal for a Standard Procedure for Moderately Accelerated Electromigration Tests on Metal Lines;Scorzoni;Microelectronics and Reliability,1999

4. Interpretation of Resistance Changes During Interconnect Reliability Testing;Sanchez,1994

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