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Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints

  • Published:2021-08 Issue:8 Volume:31 Page:2454-2467
  • ISSN:1003-6326
  • Container-title:Transactions of Nonferrous Metals Society of China
  • language:en
  • Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

HAN Yong-dian,YANG Jia-hang,XU Lian-yong,JING Hong-yang,ZHAO Lei

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference41 articles.

1. Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection [J];QIN;Electrochimica Acta,2011

2. The difference in the types of intermetallic compound formed between the cathode and anode of an Sn–Ag–Cu solder joint under current stressing [J];CHIU;Intermetallics,2009

3. Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders [J];BAATED;Journal of Materials Science,2010

4. A modified constitutive model of Ag nanoparticle-modified graphene/Sn–Ag–Cu/Cu solder joints [J];HAN;Materials Science and Engineering A,2020

5. Properties of lead-free solder alloys with rare earth element additions [J];WU;Materials Science and Engineering R,2004
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