The difference in the types of intermetallic compound formed between the cathode and anode of an Sn–Ag–Cu solder joint under current stressing
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference36 articles.
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1. Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints;Transactions of Nonferrous Metals Society of China;2021-08
2. The structural, elastic, thermodynamic, and electronic properties of (Cu6-xAux)Sn5 (x = 0, 0.5, 1, 1.5, 2) intermetallic compounds;Indian Journal of Physics;2020-10-27
3. Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory;Microelectronics Reliability;2020-04
4. Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints;Journal of Applied Physics;2019-11-14
5. Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder;MATEC Web of Conferences;2019
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