A modified constitutive model of Ag nanoparticle-modified graphene/Sn–Ag–Cu/Cu solder joints-Reference-Cited by-同舟云学术

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A modified constitutive model of Ag nanoparticle-modified graphene/Sn–Ag–Cu/Cu solder joints

Published:2020-03 Issue: Volume:777 Page:139080
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Han Y.D.,Gao Y.,Jing H.Y.,Wei J.,Zhao L.,Xu L.Y.

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference72 articles.

1. Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field;Ibrahiem;Microelectron. Reliab.,2019

2. Magnetic nanoparticle-based solder composites for electronic packaging applications;Xu;Prog. Mater. Sci.,2015

3. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy;Gao;J. Alloys Compd.,2009

4. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

5. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn–Zn and Sn–Pb solders;Islam;Microelectron. J.,2006

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1. Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints;Materials Chemistry and Physics;2024-10

2. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties;Journal of Materials Research and Technology;2024-07

3. Unravelling the synergistic enhancement effect of Ag3Sn phase and graphene nanosheets addition on the thermal cycling reliability of Sn–xAg–0.7Cu solder joint;Journal of Materials Science: Materials in Electronics;2024-05

4. Cobalt-Graphene NanoSheets enhanced Sn–0.3Ag–0.7Cu composite solder: Study on microstructure, crystal orientation relations and mechanical properties;Materials Science and Engineering: A;2024-03

5. Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection;RARE METAL MAT ENG;2023

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