Intelligent adaptive process control using dynamic deadband for semiconductor manufacturing

Author:

Ko Hyo-Heon,Kim Jun-Seok,Kim Jihyun,Baek Jun-Geol,Kim Sung-Shick

Funder

Korean Government

Publisher

Elsevier BV

Subject

Artificial Intelligence,Computer Science Applications,General Engineering

Reference19 articles.

1. Ausschnitt, C. P., Baker, B., Muth, W. A., Postiglione, M., & Walentosky, T. (2003). Industrial strength lithography APC. In Proceedings of SPIE – The international society for optical engineering (Vol. 5044, pp. 1–11).

2. Run-to-run control and performance monitoring of overlay in semiconductor manufacturing;Bode;Control Engineering Practice,2004

3. Boning, D., Moyne, W., Smith, T., Moyne, J., & Hurwitz, A. (1995). Practical issues in run process control. In Advanced semiconductor manufacturing conference and workshop, ASMC 95 Proceedings, IEEE/SEMI (pp. 201–208).

4. Further contributions to adaptive quality control: Simultaneous estimation of dynamics: Nonzero costs;Box;Bulletin of the International Statistical Institute,1963

5. Statistical control by monitoring and feedback adjustment;Box,1997

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