Wafer map defect pattern detection method based on improved attention mechanism
Author:
Publisher
Elsevier BV
Subject
Artificial Intelligence,Computer Science Applications,General Engineering
Reference35 articles.
1. Pattern classification for small-sized defects using multi-head CNN in semiconductor manufacturing;Byun;International Journal of Precision Engineering and Manufacturing,2021
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3. A self-adaptive DBSCAN-based method for wafer bin map defect pattern classification;Chen;Microelectronics Reliability,2021
4. Wafer map failure pattern recognition based on deep convolutional neural network;Chen;Expert Systems with Applications,2022
5. AI classification of wafer map defect patterns by using dual-channel convolutional neural network;Chen;Engineering Failure Analysis,2021
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2. Masked autoencoder with dynamic multi-loss adaptation mechanism for few shot wafer map pattern recognition;Engineering Applications of Artificial Intelligence;2024-11
3. DMWMNet: A novel dual-branch multi-level convolutional network for high-performance mixed-type wafer map defect detection in semiconductor manufacturing;Computers in Industry;2024-10
4. Efficient Mixed-Type Wafer Defect Pattern Recognition Based on Light-Weight Neural Network;Micromachines;2024-06-27
5. Sample-imbalanced wafer map defects classification based on auxiliary classifier denoising diffusion probability model;Computers & Industrial Engineering;2024-06
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