The influence of passivation and packaging on electromigration-Reference-Cited by-同舟云学术

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The influence of passivation and packaging on electromigration

Published:1987-05 Issue:5 Volume:30 Page:493-496
ISSN:0038-1101
Container-title:Solid-State Electronics
language:en
Short-container-title:Solid-State Electronics

Author:

Tetsuaki Wada ,Masao Sugimoto ,Tsuneo Ajiki

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Thin-Films-Interdiffusion and Reactions;d'Heurle,1978

2. Electromigration in fine‐line sputter‐gun Al

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient;Journal of the Mechanics and Physics of Solids;2023-05

3. Reliability of monolithic integrated circuits;Reliability of Electronic Components;1999

4. Stress and Electromigration;MRS Proceedings;1995

5. Effect of surface treatment on electromigration in aluminum films;IEEE Transactions on Reliability;1989

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