Nondestructive, room temperature analysis/qualification of wafer-sized semiconductor device structures using contactless electromodulation spectroscopy-Reference-Cited by-同舟云学术

Nondestructive, room temperature analysis/qualification of wafer-sized semiconductor device structures using contactless electromodulation spectroscopy

Published:1995-06 Issue:6 Volume:38 Page:1121-1129
ISSN:0038-1101
Container-title:Solid-State Electronics
language:en
Short-container-title:Solid-State Electronics

Author:

Pollak Fred H,Qiang H,Yan D,Krystek Wojciech,Moneger S

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. Encyclopedia of Materials Characterization: Surfaces, Interfaces and Thin Films;Pollak,1992

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