Quantitative analysis of performance degradation in movable MEMS devices by a multiscale approach-Reference-Cited by-同舟云学术

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Quantitative analysis of performance degradation in movable MEMS devices by a multiscale approach

Published:2024-05 Issue: Volume:159 Page:108081
ISSN:1350-6307
Container-title:Engineering Failure Analysis
language:en
Short-container-title:Engineering Failure Analysis

Author:

Cheng Jiaxing^ORCID,Chen Xuanyi,Li Zhaoxia,Lu Junxi,Liu Bangjian^ORCID

Publisher

Elsevier BV

Reference35 articles.

1. A review of actuation and sensing mechanisms in MEMS-based sensor devices;Algamili;Nanoscale Res. Lett.,2021

2. Reliability of automotive and consumer MEMS sensors-An overview;Hommel;Microelectron. Reliab.,2021

3. Review on challenges in MEMS technology;Pattanaik;Mater. Today:. Proc.,2023

4. A review of the most important failure, reliability and nonlinearity aspects in the development of microelectromechanical systems (MEMS);Rafiee;Microelectron. Int.,2017

5. S. Shubham, X. Song, Y. Ma, et al. Reliability Analysis using Advanced Modeling Technique for MEMS Microphone. In 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2021: 1-7.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Comparative Analysis of 3D Software for Modeling Fatigue Crack Growth: A Review;Applied Sciences;2024-02-23

2. MEMS Technology in the Evolution of Structural Control Strategies;E3S Web of Conferences;2024

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