Author:
Fraczkiewicz A.,Lorut F.,Audoit G.,Boller E.,Capria E.,Cloetens P.,Da Silva J.,Farcy A.,Mourier T.,Ponthenier F.,Bleuet P.
Subject
Instrumentation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference74 articles.
1. 3D integration : why, what, who, when ?;Lu;Futur. Fab Int.,2007
2. New challenges and opportunities for 3D integrations;Michailos,2016
3. Reliable 300 mm wafer level hybrid bonding for 3D stacked cmos image sensors;Lhostis,2016
4. Fabrication and characterization of sn-sn-ni-sn interconnection microstructure for electromigration studies in 3D integration;Xiao;Solder. Surf. Mount Technol.,2016
5. A review of failure analysis methods for advanced 3D microelectronic packages;Li;J. Electron. Mater.,2016
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