A study of the initiation of the tombstoning effect on leadless chips-Reference-Cited by-同舟云学术

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A study of the initiation of the tombstoning effect on leadless chips

Published:1995-09 Issue:9 Volume:35 Page:1251-1268
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Ip Kee Huit ,Ralph Brian

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference10 articles.

1. Solder pad geometry studies for surface mount of chip capacitors;Kress;IEEE Trans. Components, Hybrids, and Manufacturing Technology,1985

2. Tombstoning prevention and surface mount production;Clements;Electron. Packaging Prod.,1987

3. Infrared solder reflow of surface mounted devices;Cox;Hybrid Circuit Technol.,1985

4. Solder attachment of leadless ceramic chip carriers;Hall;Solid State Technol.,1983

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere;Soldering & Surface Mount Technology;2017-06-05

2. Influence of latent heat released from solder joints on the reflow temperature profile;Journal of Materials Science: Materials in Electronics;2015-10-07

3. Numerical investigations on the effects of different cooling periods in reflow-soldering process;Heat and Mass Transfer;2015-02-08

4. Estudo de adesivos condutivos isotrópicos utilizados para a fixação de componentes eletrônicos;Matéria (Rio de Janeiro);2006-12

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