Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Process and pad design optimization for 01005 passive component surface mount assembly;Soldering & Surface Mount Technology;2007-02-13
2. Wetting Analysis of Leadless Chips in Surface Mount Technology;The International Journal of Advanced Manufacturing Technology;2000-07-05
3. Failure Prevention;Failure Modes and Mechanisms in Electronic Packages;1998
4. A study of the initiation of the tombstoning effect on leadless chips;International Journal of Machine Tools and Manufacture;1995-09