Investigation of buried AlN layers formed by nitrogen implantation into Al
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Nuclear and High Energy Physics
Reference7 articles.
1. Multilayer ceramic packaging alternatives
2. Theoretical Analysis for a New Package Concept: High-Speed Heat Removal for VLSI Using an AlN Heat-Spreading Layer and Microchannel Fin
3. Investigation of the effects of room-temperature nitrogen implantation on the precipitation of aluminium nitride
4. High resolution depth profiling of nitrogen in A1N layers
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