1. Lin Liwei, McNair KM, Howe RT, Pisano AP. Vacuum encapsulated lateral microresonators. Proc of the 7th Conf on Solid-State Sensors and Actuators, Transducers 93, 1993;270–3.
2. Motorola, Pressure Sensors—Device Data. Motorola Semiconductor Products Sector, Phoenex, Arizona, 1994.
3. Core TA, Tsang WK, Sherman S. Fabrication technology for an integrated surface-micromachined sensor. Solid State Technology 1993;39–47.
4. Peterson KE. Silicon as a mechanical material. Proceedings of the IEEE 1982;70(5):420–57.
5. Tufte ON, Chapman PW, Long D. Silicon diffused-element piezoresistive diaphragm. J Appl Phys 1962;3322.