Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn–3.5Ag

Author:

Kanchanomai C,Miyashita Y,Mutoh Y,Mannan S.L

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

2. Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

3. A STUDY OF FATIGUE AND CREEP BEHAVIOUR OF FOUR HIGH TEMPERATURE SOLDERS

4. Isothermal Fatigue of 63Sn-37Pb Solder

5. J.F. Smith, R.R. Kubalak, Tin and tin alloy. In: W.A. Cubberly, Director, Metals Handbook, 9th ed., vol. 2, American Society for Metals, Metals Park (OH), 1979, pp. 613–625.

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