The aluminum bond-pad corrosion in small outline packaged devices-Reference-Cited by-同舟云学术

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The aluminum bond-pad corrosion in small outline packaged devices

Published:1997-03 Issue:1 Volume:48 Page:27-35
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Ueng H.Y.,Liu C.Y.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference21 articles.

1. Proc. IEEE Int. Reliability Physics Symp.;Ritz,1987

2. Effect of Bromine in Molding Compounds on Gold - Aluminum Bonds

3. Proc. Int. Rel. Phys. Technol.;DiGiacomo,1984

4. Proc. Int. Rel. Phys.;Yoshimaru,1987

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Elucidating the large variation in ion diffusivity of microelectronic packaging materials;Microelectronics Reliability;2022-09

2. Effects of molding temperature on delamination of small outline transistor (SOT);Journal of Physics: Conference Series;2022-01-01

3. Key takeaways and relevance of extrinsic corrosion mechanisms during extended biased HAST;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

4. Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate;Applied Surface Science;2015-11

5. Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure;Microelectronics Reliability;2015-06

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