Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection-Reference-Cited by-同舟云学术

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Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection

Published:2021-05 Issue: Volume:137 Page:111202
ISSN:0025-5408
Container-title:Materials Research Bulletin
language:en
Short-container-title:Materials Research Bulletin

Author:

Yin Da,Wang Qi,Zhang Shihao,Tan Baimei^ORCID,Yang Fan,Wang Ru,Sun Xiaoqin,Liu Mengrui

Funder

Hebei Natural Science Foundation Project

Major National Science and Technology Special Projects

Natural Science Foundation, China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference44 articles.

1. Effect of a novel chelating agent on defect removal during post-CMP cleaning;Hong;Appl. Surf. Sci.,2016

2. Study on the weakly alkaline slurry of copper chemical mechanical planarization for GLSI;Yao;ECS J. Solid State Sci. Technol.,2017

3. Effect of pH and chemical mechanical planarization process conditions on the copper–benzotriazole complex formation;Cho;J. Appl. Phys.,2016

4. Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective;Ein-Eli;Electrochim. Acta,2007

5. The effect of benzotriazole on brass corrosion;Mamaş;Mater. Chem. Phys.,2005

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-09

2. Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions;ECS Journal of Solid State Science and Technology;2024-05-01

3. Corrosion inhibition performance and mechanism of nitrogen-containing organic compounds on copper in an alkaline slurry;Journal of Molecular Liquids;2024-03

4. Diethylenetriamine and serine as synergists used in FA/OII based alkaline solution to realize enhanced cleaning efficiency of the organic corrosion inhibitor;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-10

5. Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study;Journal of The Electrochemical Society;2023-10-01

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