Part II: Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding of 6-mil-diameter wire
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference1 articles.
1. Grains, deformation substructures and slip bands observed in thermosonic copper ball bonding;Murali;Mater. Charact.,2003
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