Effect of Wire Purity on Copper Wire Bonding-Reference-Cited by-同舟云学术

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Effect of Wire Purity on Copper Wire Bonding

Published:2007-12 Issue: Volume: Page:
ISSN:
Container-title:2007 9th Electronics Packaging Technology Conference
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Author:

Srikanth Narasimalu,Premkumar J.,Sivakumar M.,Wong Y. M.,Vath C. J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4455348/4469670/04469764.pdf?arnumber=4469764

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1. Study of tensile properties, electrothermal characteristics and packaging reliability on Cu–Pt–Au–Pd fine micro-alloyed wire;Journal of Materials Science: Materials in Electronics;2023-05

2. Investigation of formation and breakage mechanism of microweld of typical wire-bonding materials via molecular dynamics simulation;MRS Communications;2022-09-22

3. Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading;Current Trends and Open Problems in Computational Mechanics;2022

4. Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages;Microelectronics Reliability;2021-05

5. Computational study for reliability improvement of a circuit board;Mechanics of Advanced Materials and Modern Processes;2017-06-05

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