Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate-Reference-Cited by-同舟云学术

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Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Published:2017-02 Issue: Volume:124 Page:250-259
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Yang Ming,Ko Yong-Ho,Bang Junghwan,Kim Taek-Soo,Lee Chang-Woo,Li Mingyu

Funder

Korea Institute of Industrial Technology

Shenzhen Science and Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference34 articles.

1. Lead–free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000

2. Six cases of reliability study of Pb–free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2002

3. Microstructural stability of Sn–1Ag–0.5Cu–xAl (x=1, 1.5, and 2wt.%) solder alloys and the effects of high–temperature aging on their mechanical properties;Sabri;Mater. Charact.,2013

4. High strain rate compression behavior for Sn–37Pb eutectic alloy, lead–free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys;Jenq;Microelectron. Reliab.,2009

5. Interfacial reactions between lead–free solders and common base materials;Laurila;Mater. Sci. Eng. R,2005

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1. Enhancing performance of Sn–Ag–Cu alloy through germanium additions: Investigating microstructure, thermal characteristics, and mechanical properties;Materials Today Communications;2024-03

2. Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples;Journal of the Taiwan Institute of Chemical Engineers;2024-02

3. Enhancement of SAC105 solder for vacuum soldering with Cu substrates through incorporation of activated Ti nanoparticles;Journal of Materials Research and Technology;2024-01

4. Ultra-low-temperature lead-free multicomponent alloy solder for application in heat-sensitive electronic components;Materials Letters;2023-07

5. Nucleation and growth of intermetallic compounds on the prefabricated Cu6Sn5 layer;Materials Chemistry and Physics;2023-02

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