Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
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3. Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints;Bieler;IEEE Trans Compon Packag Technol,2008
4. Three-dimensional finite element analysis of multiple-grained lead-free solder interconnects;Park;J Electron Mater,2008
5. Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling;Chen;J Mater Res,2011
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