Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing
Author:
Funder
City University of Hong Kong
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference49 articles.
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1. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps;Journal of Materials Research and Technology;2024-05
2. Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions;Journal of Materials Science: Materials in Electronics;2024-05
3. Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
4. In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints;Journal of Materials Research and Technology;2023-09
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