Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy-Reference-Cited by-同舟云学术

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Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

Published:2015-01 Issue:1 Volume:4 Page:84-92
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Bogno Abdoul-Aziz,Spinelli José Eduardo,Afonso Conrado Ramos Moreira,Henein Hani

Funder

CNPq

FAPESP

CALDO

Natural Science and Engineering Research Council

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference18 articles.

1. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater Sci Eng R,2004

2. Lead-free solders in microelectronics;Abtew;Mater Sci Eng R,2000

3. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy;Mahmudi;Mater Des,2009

4. Effect of addition of nano-copper and extrusion temperature on the microstructure and mechanical response of tin;Alam;J Alloys Compd,2010

5. Effect of rapid solidification on structure and properties of some lead-free solder alloy;Kamal;Mater Manuf Process,2006

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification;Materials Today Communications;2024-03

2. Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy;Journal of Materials Research and Technology;2023-09

3. A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering;Encyclopedia of Materials: Electronics;2023

4. A review: effect of copper percentage solder alloy after laser soldering;Soldering & Surface Mount Technology;2022-12-01

5. Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic;Results in Materials;2022-12

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