1. The National Technology Roadmap for Semiconductors, SIA, San Jose, CA, 10, 1997
2. Current distribution;Ibl,1983
3. Transient plating-rate distribution on resistive thin films with point contact terminals;Mehdizadeh,1997
4. Model of wafer thickness uniformity in an electroplating tool;Deligianni,1999
5. Nonuniform current distribution and thickness during electrodeposition onto resistive substrates;Matlosz;J. Electrochem. Soc.,1992