Effects of Ultrasonic Process on the Electroless Cu Plating on Non-Conductive Printed Circuit Board Substrate
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Published:2018-09-01
Issue:9
Volume:10
Page:1292-1296
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ISSN:1941-4900
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Container-title:Nanoscience and Nanotechnology Letters
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language:en
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Short-container-title:nanosci nanotechnol lett
Author:
Kang Ju-Suk,Chun Hong-Wook,Lee Jae-Ho
Publisher
American Scientific Publishers
Subject
General Materials Science