Heat Transfer Challenges in Semiconductors Processing and the Applications of Heat Pipes for Efficient Heat Removal-Reference-Cited by-同舟云学术

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Heat Transfer Challenges in Semiconductors Processing and the Applications of Heat Pipes for Efficient Heat Removal

Published:2003 Issue:1 Volume:15 Page:141-154
ISSN:1018-3639
Container-title:Journal of King Saud University - Engineering Sciences
language:en
Short-container-title:Journal of King Saud University - Engineering Sciences

Author:

Alahmad M.,El-Aleem F. Abd

Publisher

Elsevier BV

Subject

General Engineering

Reference9 articles.

1. Introduction to ASI on Cooling Electronic Systems;Kakac,1994

2. Thermal Analysis and Control of Electronic Equipment;Kraus,1983

3. Trends in the Packaging of Computer Systems;Cohen,1994

4. Information Processing and Heat Transfer Engineering;Nakayama,1994

5. An Introduction to Heat pipes, Modeling, Testing and Applications;Peterson,1994

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