Interfacial evolution and mechanical properties of Au–Sn solder jointed Cu heat sink during high temperature storage test
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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1. Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging;Journal of Materials Science: Materials in Electronics;2024-09
2. Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-06
3. Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al;Journal of Materials Science: Materials in Electronics;2023-08
4. An Ultrathin Transparent Radiative Cooling Photonic Structure with a High NIR Reflection;Advanced Materials Interfaces;2022-09-09
5. The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation;Materials;2022-02-17
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