Insights into the behavior of Sn on NiPdAu surface: Diffusion energetics in complex multilayered surfaces
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis
2. A study of intermetallic compound formation in a copper–tin bimetallic couple
3. The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
4. Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
5. Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints
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