Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
2. Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
3. Elimination of Au-embrittlement in solder joints on Au/Ni metallization
4. Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
5. Interfacial microstructure evolution in Pb-free solder systems
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