Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish-Reference-Cited by-同舟云学术

Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

Published:2001-09 Issue:9 Volume:30 Page:1152-1156
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liu C. M.,Ho C. E.,Chen W. T.,Kao C. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0143-7.pdf

Reference10 articles.

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5. A. Zribi, R.R. Chromik, R. Presthus, J. Clum, K. Teed, L. Zavalij, J. DeVita, J. Tova, and E.J. Cotts, Proc. 49th IEEE Electron. Comp. Tech. Conf. (1999), p. 451.

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