Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference33 articles.
1. Interdiffusion and reaction in bimetallic Cu-Sn thin films
2. Room Temperature Interaction in Bimetallic Thin Film Couples
3. Kinetics of interfacial reaction in bimetallic CuSn thin films
4. Microstructure evolution of eutectic Sn-Ag solder joints
5. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures;Thin Solid Films;2014-04
2. Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates;Metals and Materials International;2014-03
3. Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-xZn)/Cu (x = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram;MATERIALS TRANSACTIONS;2014
4. Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging;ECS Solid State Letters;2012-11-28
5. Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging;Journal of Materials Science & Technology;2012-01
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