Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation
Author:
Funder
HIR Grant, University of Malaya
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints
2. Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy
3. Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending
4. Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films
5. Evaluation of local strain evolution from metallic whisker formation
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