Low temperature bonding process of high density Cu bumps Array
Author:
Affiliation:
1. Hubei University of Technology,School of Chip Industry,Wuhan,China,430068
2. Hubei University of Technology,School of Chip Industry School of Science,Wuhan,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873525.pdf?arnumber=9873525
Reference13 articles.
1. Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation
2. Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
3. Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining
4. The Cu Cu self-propagating reaction joining with different thickness of tin
5. Low Temperature Cu-to-Cu Bonding for Wafer-Level Hermetic Encapsulation of 3D Microsystems
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