Fabrication of Al thin wire by utilizing controlled accumulation of atoms due to electromigration
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference6 articles.
1. Governing parameter for electromigration damage in the polycrystalline line covered with a passivation layer
2. Electromigration in thin gold films on molybdenum surfaces
3. Plasticity of electromigration-induced hillocking and its effect on the critical length
4. Spontaneous growth mechanism of tin whiskers
5. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
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1. Electromigration-Driven Crystallinity Design of Metallic Nanowire;Journal of the Society of Materials Science, Japan;2022-09-15
2. Intermetallic compound formation inhibiting electromigration-based micro/nanowire growth;Journal of Vacuum Science & Technology B;2021-12
3. Fabrication of Ag micro-particles based on stress-induced migration by using multilayered structure with artificial holes array;Science Progress;2021-07
4. Equilibrium current density balancing two atomic flows in coupled problems of electromigration and thermomigration in unpassivated gold film;AIP Advances;2020-08-01
5. Residual stress effect governing electromigration-based free-standing metallic micro/nanowire growth behavior;Applied Physics Letters;2020-01-13
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