Embedding of copper into submicrometer trenches in a silicon substrate using the molecular precursor solutions with copper nano-powder
Author:
Funder
MEXT
JSPS
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
2. Damascene copper electroplating for chip interconnections
3. A vacuum plasma surface pretreatment for refining seeding of Co in electroless copper plating
4. Displacement Activation of Tantalum Diffusion Barrier Layer for Electroless Copper Deposition
5. Effects of heat treatment on electroless copper-deposited film in TaN diffusion barrier
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