Effects of heat treatment on electroless copper-deposited film in TaN diffusion barrier
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Multilevel interconnections for ULSI and GSI era
2. Instability of Si—F bonds in fluorinated silicon oxide (SiOF) films formed by various techniques
3. Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance
4. Electrochemical Deposition of Copper on n‐Si/TiN
5. Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films
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1. Characterization of Electroless-Deposited Ternary M1M2-R (M1 = Co, Ni, M2 = W, Mo, R = P, B) Nano Thin Film for Optical-Sensor Interconnects;Science of Advanced Materials;2017-11-01
2. Embedding of copper into submicrometer trenches in a silicon substrate using the molecular precursor solutions with copper nano-powder;Materials Letters;2016-11
3. Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process;Applied Surface Science;2015-11
4. A vacuum plasma surface pretreatment for refining seeding of Co in electroless copper plating;Thin Solid Films;2010-05
5. Electroless copper deposition on silicon with titanium seed layer;Materials Chemistry and Physics;2006-07
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