Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process-Reference-Cited by-同舟云学术

Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process

Published:2002 Issue:7 Volume:43 Page:1593-1598
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Haba Toshio¹,Itabashi Takeyuki¹,Akahoshi Haruo¹,Sano Akihiro¹,Kobayashi Kinya¹,Miyazaki Hiroshi²

Affiliation:

1. Hitachi Research Laboratory, Hitachi Ltd.

2. Semiconductor & Integrated Circuits Group, Hitachi Ltd.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/7/43_7_1593/_pdf

Reference9 articles.

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2. 2) P. C. Andricacos: Interface 8 (1999) 32.

3. 3) P. C. Andricacos, C. Uzoh, J. O. Dukovic and J. Horkans and H. Deligiai: IBM J. Res. Dev. 567 (1998) 42.

4. 4) K. M. Takahashi and M. E. Gross: J. Electrochem. Soc. 146 (1999) 4499.

5. 6) K. Kobayashi, A. Sano, H. Akahoshi, T. Itabashi, T. Haba, S. Fukada and H. Miyazaki: Proceedings of the 2000 International Interconnect Technology Conference, pp. 34.

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