Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure

Published:2023-01 Issue: Volume:331 Page:133501
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Chen Liping,Chen Shuhui,Chen Peixin,Cao Liang,Li Ming,Hang Tao

Funder

National Natural Science Foundation of China

Shanghai Jiao Tong University

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

2. Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

3. Co-W nanocrystalline electrodeposits as barrier for interconnects

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction;Materials;2024-07-25

2. Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface;Journal of Materials Science: Materials in Electronics;2024-05

3. Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions;Electronic Materials Letters;2024-04-13

4. Review on the electrodeposition and properties of high-density chip interconnection;SCIENTIA SINICA Chimica;2023-08-23

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP