Wettability of molten Sn–Bi–Cu solder on Cu substrate
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
1. Lead-free Solders in Microelectronics
2. Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
3. Compound formation for electroplated Ni and electroless Ni in the under-bump metallurgy with Sn-58Bi solder during aging
4. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
5. Interfacial Reactions Between Liquid Sn-8Zn-3Bi Solders and Cu Substrates
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2. Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces;Metals;2024-08-25
3. Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys;Welding International;2024-02-26
4. Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate;Materials Performance and Characterization;2023-06-16
5. A Review of Low-Temperature Solders in Microelectronics Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
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