Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Author:

Kang Sung K.,Leonard Donovan,Shih Da-Yuan,Gignac Lynne,Henderson D. W.,Cho Sungil,Yu Jin

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. NCMS Lead-Free Solder Project Final Report (Ann Arbor, MI: NCMS, 1997).

2. P.T. Vianco and C. May, “An Evaluation of Prototype Surface Mount Circuit Boards Assembled with Three Non-Lead Bearing Solders,” Proceedings of SMI ’95, (Edina, MN: SMTA, 1995), pp. 481–494.

3. NCMS High-Temperature Fatigue-Resistant Solder Project, Final Report (Ann Arbor, MI: NCMS, 2001).

4. Lead-Free Roadmap (Tokyo, Japan: Japan Electronics and Information Technology Industries Association (JEITA), 2002).

5. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly 11, 45 (2000).

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