Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn-Reference-Cited by-同舟云学术

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Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn

Published:2015-10 Issue: Volume:156 Page:150-152
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Li C.C.,Ke J.H.,Yang C.A.,Kao C.R.

Funder

Ministry of Science and Technology of Taiwan

National Taiwan University

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference12 articles.

1. Critical concerns in soldering reactions arising from space confinement in 3-D IC packages;Chuang;IEEE Trans Device Mater Rel,2012

2. Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints;Li;Metall Mater Trans A,2014

3. Effect of dissolution and intermetallic formation on the reliability of FC joints;Kulojärvi;Microelectron Int,1998

4. Elimination of voids in reactions between Ni and Sn: a novel effect of silver;Chuang;Scripta Mater,2012

5. Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications;Yu;J Alloy Compd,2015

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4. Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review;Journal of Advanced Joining Processes;2022-11

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