Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening
Author:
Funder
Ministry of Education, India
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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1. A Review of 5G Front-End Systems Package Integration
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Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias;Materials Science in Semiconductor Processing;2024-11
2. Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining;Journal of Manufacturing Processes;2024-08
3. Continuous Electroless Seed Layer Deposition in Through-Glass-Vias by Ultrasonic Agitation;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
4. Acoustic-streaming driven liquid filling patterns inside through-glass vias;Physics of Fluids;2024-07-01
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