Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining-Reference-Cited by-同舟云学术

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Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining

Published:2024-08 Issue: Volume:124 Page:52-67
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Pandey Harsh^ORCID,Apurva Abhinav,Dixit Pradeep^ORCID

Publisher

Elsevier BV

Reference41 articles.

1. Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs;Sukumaran;IEEE Trans Compon Packag Manuf Technol,2012

2. High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE;Dixit;J Electrochem Soc,2007

3. Fabrication and characterization of through-glass vias by the ECDM process;Kannojia;J Electrochem Soc,2019

4. Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution;Iliescu;Surf Coat Technol,2005

5. Effect of process gases on fabricating tapered through-silicon vias by continuous SF6/O2/Ar plasma etching;Dixit;ECS J Solid State Sci Technol,2012

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias;Materials Science in Semiconductor Processing;2024-11

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