A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
Author:
Affiliation:
1. Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India
Funder
Prime Minister's Research Fellowship
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/02670844.2022.2142002
Reference252 articles.
1. High-Performance Nanowire Electronics and Photonics on Glass and Plastic Substrates
2. glassPack: a novel photonic packaging and integration technology using thin glass foils
3. Fabrication of High Aspect Ratio 35 /spl mu/m Pitch Interconnects for Next Generation 3-D Wafer-Level Packaging by Through-Wafer Copper Electroplating
4. Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite
5. Maskless manufacturing of through glass vias (TGVS) and their test structures
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