Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration-Reference-Cited by-同舟云学术

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Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration

Published:2014-12 Issue: Volume:137 Page:136-138
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Chang Y.W.,Chen Chih,Chang T.C.,Zhan C.J.,Juang J.Y.,Huang Annie T.

Funder

National Science Council Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference9 articles.

1. Reliability challenges in 3D IC packaging technology;Tu;Microelectron Reliab,2011

2. Hwang J, Kim J, Kwon W, Kang U, Cho T, Kang S. Fine pitch chip interconnection technology for 3D integration. In: Proceedings of the IEEE electronic components and technology conference, Las Vegas, NV, USA; 2010 June 1–4. pp. 1399–1403.

3. Zhan CJ, Chuang CC, Juang JY, Lu ST, Chang TC. Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection. In: Proceedings of the IEEE electronic components and technology conference, Las Vegas, NV, USA; 2010 June 1–4. pp. 1043–1049.

4. Labie R, Limaye P, Lee KW, Berry CJ, Beyne E, De Wolf I. Reliability testing of Cu–Sn intermetallic micro-bump interconnections for 3D-device stacking. In: Proceedings of the 3rd IEEE electronic system-integration technology conference, Berlin, Germany; September 13–16, 2010. pp. 1–5.

5. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes;Chang;Appl. Phys. Lett.,2006

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1. Effect of Joule heating on the reliability of microbumps in 3D IC;Journal of Materials Research and Technology;2024-07

2. Electromigration in three-dimensional integrated circuits;Applied Physics Reviews;2023-05-16

3. Effective Constitutive Relations for Sintered Nano Copper Joints;Journal of Electronic Packaging;2022-11-11

4. Effect of the Electromagnetic Susceptibility of Metal Interconnects: A Simulation Study;Journal of Physics: Conference Series;2022-01-01

5. Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly <111>-oriented nanotwinned structures;Journal of Materials Research and Technology;2021-11

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