Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking-Reference-Cited by-同舟云学术

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Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking

Published:2010-09 Issue: Volume: Page:
ISSN:
Container-title:3rd Electronics System Integration Technology Conference ESTC
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Author:

Labie R,Limaye P,Lee KW,Berry CJ,Beyne E,De Wolf I

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5629474/5642799/05642925.pdf?arnumber=5642925

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Cu-Cu Direct Bonding Process Utilized by High Porosity and Nanocrystal Structure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs;IEEE Transactions on Electron Devices;2023-01

3. Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates;Journal of Materials Science: Materials in Electronics;2022-01-21

4. Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging;Journal of Materials Science: Materials in Electronics;2021-12-02

5. Interconnect Quality and Reliability of 3D Packaging;3D Microelectronic Packaging;2017

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