Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-μm logic process-Reference-Cited by-同舟云学术

Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-μm logic process

Published:2001-11 Issue: Volume:398-399 Page:544-548
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Lan J.K,Wang Y.L,Lo K.Y,Liu C.P,Liu C.W,Wang J.K,Cheng Y.L,Chau C.G

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference14 articles.

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