New packages for disc type power diodes-Reference-Cited by-同舟云学术

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New packages for disc type power diodes

Published:2012-09 Issue:15 Volume:177 Page:1304-1309
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Raj Ewa,Lisik Zbigniew,Gozdur Roman,Fiks Włodzimierz

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference22 articles.

1. Power Device Packaging Technologies for Extreme Environments

2. Proceedings of the HITEN’2009;Vermesan,2009

3. Fuji Electric, the company web site http://www.fujielectric.com (accessed 30.10.11).

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1. Power Diode Packages with Embedded Microchannel Cooler: Is Further Improvement Possible?;2024 IEEE 18th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG);2024-06-24

2. Novel Press-Pack Power Diode DBW3-3500 With Integrated Microchannel Cooling System;IEEE Transactions on Power Electronics;2023-08

3. Analiza numeryczna chłodzenia cieczowego elementarnych hybrydowych modułów solarnych;PRZEGLĄD ELEKTROTECHNICZNY;2022-01-04

4. Super-efektywne mikrokanałowe cieczowe systemy chłodzenia dla energoelektroniki;PRZEGLĄD ELEKTROTECHNICZNY;2020-07-01

5. Thermal investigation of power diodes in novel integrated disc type packages;Journal of Physics: Conference Series;2020-04-01

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